printed-circuit assembly

基本解释

The printed circuit board assembly encapsulates and adheres the plastic-encapsulated electronic parts on the printed circuit board without welding technology.
该印刷电路板装配体在不进行焊接工艺的情况下将塑封的电子部件封装粘接到印刷电路板。
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Quad Flat No-lead(QFN)package of microwave chip is a relatively new packaging. It offers a small size and especially fits for high density printed circuit assembly.
QFN封装的微波芯片采用一种较新的封装形式，这种封装体积很小，特别适合高密度印刷电路板组装。
The measurement method of the characteristic parameters of the cleaning quality about welded printed circuit board assembly cleaned by non-ODS cleaner is introduced in this paper.
本文主要介绍了印制电路板组装件焊接后非ODS清洗剂清洗质量表征参数的测量方法。